In this work a dislocation density-based model is used to describe viscoplastic behavior of lead-free solder alloy containing small additions. This micromechanical model can predict dislocation densities and grain sizes evolutions during loading. The model assumes the dislocation densities as a sum of cell interior dislocation density and wall dislocation density. The latter is a superposition of statistical dislocation density and geometrically necessary dislocation. The model has been implemented into the finite element code Abaqus/Explicit throughout a Fortran coded user-defined subroutine and is used to simulate tensile tests of solder alloy specimens under different temperature and strain rates. Good agreement were found between numerical predictions and experimental results.
| Type : | : | oral |
| Thématiques | : | S25 - Approches multi-échelles en mécanique des solides |
| Mots-Clés | : | Dislocation density ; Viscolplastic behavior ; Solder alloy ; Finite element implementation |
| PDF version | : |  PDF version |
